How to use
| CLEANING | FORMING | SOLDERING | PREVENTING OVER-CURRENT | BRIGHTNESS AND COLOR |

Quality Control And Assurance
| SAMPLING PLAN | INSPECTION ITEMS AND CRITERION FOR JUDGEMENT | RELIABILITY TESTS  |

How to use
CLEANING

Don't use unspecified chemical liquid to clean the LED because it may cause cracks or haze on surfaces of the lens. If cleaning is necessary, please immerse the LED in alcohol or Freon TE at normal temperature for less than 1 minute.

 
 

Effect of ultrasonic cleaning on the LED resin body differs depending on factors such as the oscillator output, size of PCB and LED mounting method. So the use of ultrasonic cleaning is strongly recommended after confirming that there is no problem.
 
 

FORMING
If forming is required, it must be done before soldering. Form pin leads by securing minimum 2mm from body and bedding with radio pliers or equivalent to avoid pressure on resin. When the LED is mounted into a PC board, pitch spacing should be aligned to prevent any stress to the resin.
 
 
Any unsuitable stress applied to the resin to the resin may break the bonding wire in LED, which will cause failure.

SOLDERING
The soldering specification is 260°C for 5 seconds, and soldering iron should be operated under 30W.
Don't apply any force or mechanical stress onto the leads epoxy body when soldering heat is still remained.
If soldering one line of LEDs on a PC board by a soldering iron. don't solder both the leads of the LEDs at the same time.
 
Hold pin leads with tweezers during soldering to prevent heat transfer to the dice, especially for small size LEDs.

PREVENTING OVER-CURRENT

Apply over-current may cause LED failure or reduce life and brightness.
Put protective resistors in series not only prevent over-current, but also stabilize the LED performance.
Resistor value can be determined by the formula.
 

BRIGHTNESS AND COLOR
To obtain uniform, brightness, LEDs should be operated at the same current.
It is useful for uniform brightness if larger source voltage and protective resistor are used.
Use forward current of 20 mA to obtain the best uniform brightness on yellow and green LED's.
Check at a distance of 30cm from the LED to the eye.

Quality Control And Assurance
SAMPLING PLAN

U.S. Ministry of defence MIL-STD-105E level II (Single Sample Plans)  

INSPECTION ITEMS AND CRITERION FOR JUDGEMENT

Measuring Methods for Light Emitting Diodes (No. 11830) and Light Emitting Diodes (No.11829).
Stipulated by Ministry of Economical Affairs of R.O.C. and by reference to QC standards prevailing in prominent LED plants worldwide.
 

RELIABILITY TESTS
General Provisions for Environmental Tests of CNS-Categorized Electronics Parts, 3623-3634, 567, 11233-11238, and U.S. Ministry of National Defence MIL-STD-750 Specifications.

 

TEST
CONDITIONS
THERMAL SHOCK
TEST
LED placed in a chamber (-44°C) for 20 minutes, temperature increased instantaneously to + 88°C for 20 minutes.The duration of the test shall be for 10 complete cycles.
HUMIDITY
TEST
LED placed in humidity chamber which is maintained at 40°C, 95% R.H.The duration of test is for 96 hours.
LIFE
TEST
LED connected to a source of power and charged with 10mA at room temperature (25°C) for 1000 hours.
SOLDER
ABILITY
TEST
The pins of LED (1.6mm from body) dipped into tin which is maintained at 260°C with +/- 5°C.
VIBRATION
TEST
LED placed on a vibrator which is maintained at 10-55-10 Hz/minute. 0.82mm amplitude. The duration of the test is 30 minutes.
PACKING
TEST
LED packed in a corrugated fibreboard box and fallen freely on 6 faces at a diagonal angle to the ground. The altitude of the fall will be in the range of 229-609 mm considering of the packed product.

MEASURING TERMS
FAILURE CRITERIA
LUMINOUS INTENSITY (IV)
LOWER STANDARD LIMIT x 0.5
FORWARD VOLTAGE (IF)
UPPER STANDARD LIMIT x 1.2
REVERSE CURRENT (IR)
UPPER STANDARD LIMIT x 2.0

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